• The device involves a thin film of aluminum deposited on top of a silicon layer placed under strain, used to create an electronic cooling process. The electrons in the silicon layer are so isolated from the silicon lattice they become highly sensitive to incoming radiation. This “e-cooling” process is the secret to Q-Eye sensor’s ability to carry out rapid imaging and material identification the team claims.
  • What’s more, the device can be made using standard silicon processes, enabling large numbers of detector chips containing designs matched to a particular application to be fabricated on large (300mm) wafers with great uniformity.
  • They claim that it could help address the weaknesses reported earlier this month in America’s airport security, where mock weapons and explosives were smuggled through airports, undetected in 95% of cases.

Share This Article